What is the difference between SOIC and SSOP?
08 February 2025
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When designing a PCB, among the many IC package types, SOIC (Small Outline Integrated Circuit) and SSOP (Shrink Small Outline Package) are two common surface mount options. Although they look similar, there are differences between them.
1. What is SOIC?
SOIC stands for Small Outline Integrated Circuit. It is a surface mount package used to house integrated circuits. SOIC packages are widely used due to their compactness and ease of soldering. They usually have:
Wider pin pitch: The distance between adjacent pins is usually 1.27 mm, and the overall size is larger compared to SSOP.
Dual in-line pin arrangement, with pins on both sides of the package. SOIC is suitable for applications where space is limited but not as critical as miniaturized devices. Its slightly larger size makes it easier to handle during manufacturing and assembly.
2. What is SSOP?
SSOP stands for Shrink Small Outline Package, which is essentially a smaller and more compact version of the SOIC package. SSOP is designed for applications that require tighter space optimization. Key features of SSOP include:
Narrower pin pitch: The distance between adjacent pins is typically 0.635 mm, half that of SOIC. The overall smaller size makes it ideal for high-density circuit designs.
A similar dual-in-line pin arrangement to SOIC, but with a finer pitch. SSOP is commonly used in smartphones and wearable devices, where space saving is a top priority.
Conclusion
Both SOIC and SSOP are excellent IC packaging options. SOIC is larger and easier to use, while SSOP is smaller and better suited for space-constrained applications.
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