Empowering the future of connectivity with advanced PCB manufacturing and assembly services for 5G technologies
Specialized in producing high-frequency PCBs designed for 5G and wireless applications;
IPC certification to ensure compliance with rigorous industry standards;
Capabilities include fabricating complex multi-layer PCBs to support advanced connectivity.
Precision SMT assembly for compact wireless components;
IPC-certified assembly team ensuring the highest quality for critical applications;
Expertise in assembling advanced components such as BGA and QFN.
UL, RoHS, IPC Standards, ISO 9001, ISO 14001 certifications;
Utilizing advanced AOI and X-ray inspection equipment to guarantee product quality;
Conducting 100% functional testing to ensure reliability in wireless applications.
Annual production capacity exceeds 40,000+ square feet of PCB boards;
Fast delivery cycles as short as 5 working days;
Possessing UL, IPC, ROHS and other safety certifications to meet global demands.
Manufacturing feasibility analysis of customer designs, providing optimization suggestions for reliability and efficiency.
Detailed analysis and manufacturing of PCBs tailored for 5G applications, ensuring top performance.
We source original parts at competitive prices, providing alternatives for critical components.
Employing lead-free soldering processes compliant with RoHS standards, ensuring eco-friendly practices.
Conducting specialized tests to simulate operational environments, ensuring product reliability.
Implementing full-process barcode management, assigning unique IDs to each PCB for quality tracking.