Abridge | Explain |
PCB | Printed circuit board |
PCBA | Printed circuit board assembly |
FR4 PCB | The most commonly used materials in PCBs |
Aluminum PCB | Commonly used in LED lighting, TV backlighting |
Cem-1 PCB | Composite board, the board body is white, not easy to bend, only single-sided, simple structure, commonly used in the field of toys. |
Rogers PCB | Refers to printed circuit boards consisting of high-performance materials manufactured by Rogers Corp. |
HF & RF PCB | PCBs with higher frequency signals |
Teflon PCB | PCBs that are resistant to acids and alkalis and are virtually insoluble in all solvents. |
Impedance controlled board | It is a PCB that pays special attention to the impedance matching requirements of specific signal paths on the board during the design and manufacturing process. |
HDI PCBs | High Density Interconnect Printed Boards with Better Performance and Smaller Size |
PCB Layer | PCB has different number of layers according to different needs, the more layers the higher requirements |
Multilayer PCB | / |
Double layer PCB | / |
Rigid PCB | Common PCB Types |
FPC | PCBs that can be bent and folded |
Stiffener | FPC-specific processes |
Rigid-flex PCB | PCBs made from a combination of flexible and rigid boards. |
Thick copper PCB | / |
Surface finish treatment | / |
HASL | Hot Air Solder Level, processes in PCB manufacturing |
Lead-free HASL | Lead-free Hot Air Solder Level, processes in PCB manufacturing |
Flash Gold | Rapid gold plating |
ENIG | Immersion Gold |
Gold Finger PCB | / |
OSP | Organic Solderability Preservatives |
Immersion Tin | / |
Immersion Silver | / |
Hard Gold | / |
Drill/hole | / |
laser drill | / |
Minimum hole size | / |
Mechanical drill | / |
Minimum Annular Ring | / |
Plugging Visa capability | / |
Resin Filled/Plugging | / |
Copper plugging | / |
Lasering drilling | / |
Via | / |
Vias older mask opening | / |
Vias solder mask filling | / |
Vias solder mask covering | / |
PTH | Plating Through Hole |
NPTH | Non-Plated through holes |
Stamp hole | / |
slot hole | / |
half hole | / |
Countersink hole | / |
Tolerance | / |
Plated holes Tolerance | / |
Non-plated hole tolerance | / |
Outline Tolerance | / |
Max Copper thickness | / |
Max Production size | / |
Min Solder Mask Bridge | / |
Max PCB size | / |
Min Solder Mask Bridge | / |
Board Thickness | / |
Aspect ratio | / |
Line/Trace/Circuit | / |
Minimun line width | / |
Minimun line gap | / |
Peel off strength | / |
Thermal Stress tes | / |
Solder mask hardness | / |
E-Test voltage | / |
Warp and Twist | / |
Solder Mask | / |
Insulating resistance | / |
peelable mask | / |
Impedance controlled | / |
Fiducial Aligment point | / |
TP | Test pad |
EQ | Engineer question |