What are buried and blind vias in PCB?
20 December 2024
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PCBs are essential for electronic devices, and the demand for smaller and more efficient devices has led to the development of HDI PCBs, which has also prompted the technology of buried and blind vias. But what are buried and blind vias in PCB?
What are through-holes?
A through-hole is a small hole drilled in a PCB to connect different layers of the board. There are three types of through-holes:
Through-hole: A hole that runs through the entire PCB, from the top layer to the bottom layer.
Blind via: A hole that connects the outer layer of a PCB to the inner layer but does not pass through the entire board.
Buried via: A hole that is completely enclosed within a PCB, connecting two or more inner layers but not reaching any outer
What is a blind via?
A blind via is a special type of hole that starts from the outer surface of the PCB, only enters a part of the board, and does not pass completely through the PCB.
Main features of blind vias
Because it does not pass through the entire PCB, it can free up more space. It plays a big role in compact designs such as smartphones and wearable devices. At the same time, blind vias play a big role in creating HDI PCBs with very high density. But at the same time, blind vias are more expensive to manufacture than through holes.
Common uses of blind vias
Used to connect surface mount components to inner layers.
Reducing the number of through holes leaves room for routing signals.
What are buried vias?
Buried vias are holes that connect multiple inner layers of a PCB but do not reach the outer layers. Completely enclosed in the board, invisible from the outside.
Main features of buried vias:
Buried vias are hidden inside the PCB, and the outer layers look simpler. Electromagnetic interference can also be reduced. Buried vias are used in multi-layer PCBs and HDI PCBs to connect inner layers without interfering with outer layers.
Conclusion
Buried vias and blind vias PCBs are in the form of through holes, buried vias are completely hidden inside, and blind vias are only visible on one side and do not penetrate the other side. Suitable for HDI PCBs as small size applications.
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