What affects the quality of SMT solder paste?
27 December 2024
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The quality of solder paste is very important in SMT assembly and directly affects the quality of soldering. So what factors affect the quality of SMT solder paste?
Storage conditions
Storage is critical to maintaining the quality of solder paste. Improper storage can cause solder paste separation, oxidation and degradation. Therefore, the solder paste should not only be sealed to prevent oxidation, but also the temperature should be kept between 0-10°C. Before use, the solder paste should reach room temperature to maintain the correct viscosity.
Environmental factors
Temperature and humidity also affect the quality of solder paste. The working environment should maintain a temperature of 20-25°C (extreme temperatures will change the rheological properties of the solder paste) and 45-65% Humidity (high humidity can cause moisture absorption and affect solder paste viscosity).
Printing process
First make sure the stencil is clean, dirty stencils will cause inconsistent printing. Too much pressure on the scraper after the start will damage the stencil and PCB, while insufficient pressure will cause incomplete printing. The printing speed will also affect the solder paste rolling and deposition consistency
Working time
The working time after the solder paste is taken out of storage should control the kneading time to maintain the appropriate viscosity and minimize the exposure time on the stencil.
Solder paste affects the quality of soldering, these factors are interrelated, and maintaining the best conditions for each aspect is important to achieve high-quality SMT assembly results.
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