List of bad situations during PCB manufacturing

20 January 2025

During the PCB manufacturing process, there are many problems that can lead to increased production costs and delayed delivery. Here is a list of some common situations.

Drilling (DR)		Drilling anomaly causes the hole not to be drilled to the graphic position
		Component holes are 2mil, and via holes are allowed to be tangent; Those shown in the picture should be scrapped.
		1. The positioning is not correct when the hole is filled after the drilling is missed; 2. The positioning is not ideal; 3. The pin hole is too large, resulting in poor fixation.
		1. Component holes are 2mil, and electrical holes are allowed to be tangent; 2. Scrap as shown in the figure.
		1. Failure to produce according to the information provided by the Engineering Department, and unauthorized changes to the information resulted in more holes than the specified number; 2. Wrong information was used.
		Scrapped
		No borehole
		1, with red philine beat; 2. This drawing is not acceptable.
		Improper operation or equipment problems cause sharp objects to hit the board surface and cause the base copper to fall off.
		1. Scrap at the line bends and pads; 2. Repair the line; 3. UAI on the large copper sheet.
		The positioning is not ideal, the positioning hole is larger than the pin, causing the second drill hole to deviate from the pattern.
		Scrapped
Copper (PTH)		Electroplated copper bubbles
		Scrapped
		Copper cylinder liquid pollution, the external environment dust into the copper cylinder, resulting in granular copper on the surface.
		The maximum diameter of the copper particles should be less than 0.05mm, and there should be no more than 5 in every 304.8mm×304.8mm area.
		Improper operation or equipment problems cause sharp objects to hit the plate surface and make the base copper fall off.
		1. Scrap at the line bends and pads; 2. Repair the line; 3. UAI on the large copper sheet.
		Copper cylinder pollution, residual copper on the surface
		The residual copper between the lines shall not affect the line width and spacing, and the length shall be <13mm. The residual copper on the effective plate surface shall be repaired.
Outer dry film (ODF)		Residual copper
		1. It does not affect the line width and line spacing; 2. The residual copper on the large copper surface is allowed to be 1.0mm and the copper must not be exposed. Only one is allowed within an area of 9 square centimeters.
		The board got stuck during the grinding process and was damaged.
		Scrapped
		Developer contamination
		1. 10 * 10 MM 2 on large copper foil is acceptable; 2. Not acceptable on circuits or pads.
		Short circuit
		Scrapped
		Poor exposure results in an open circuit.
		Scrapped
		During the exposure process, small film fragments or other foreign matter adhere to the pad, causing gaps.
		1. No gaps are allowed in IC, BGA and gold finger positions; 2. No gaps are allowed in the middle of square and round pads, but 5% is allowed around them.
		Expose the substrate
		1. No gaps are allowed in the IC position; 2. No gaps are allowed in the middle of square and round pads, but 5% is allowed around them.
		Etchant contamination
		Meet MI line width spacing requirements.
		Scratches caused by human operation problems
		Scrapped
		The etching speed is too slow, the temperature is too high, and the concentration of the solution is too high, resulting in thin lines.
		Within the requirements provided by the customer.
		1. Poor etching uniformity; 2. Nozzle clogged; 3. Incorrect etching parameters.
		Scrapped

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