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Differences between LGA, PGA and BGA | POE
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Differences between LGA, PGA and BGA

When it comes to integrated circuits, common package types are LGA (Land Grid Array), PGA (Pin Grid Array) and BGA (Ball Grid Array). These packaging technologies determine how the chip is connected to the motherboard.
Home >Blog >PCB/ PCBA Blog > Differences between LGA, PGA and BGA
Differences between LGA, PGA and BGA
15 January 2025
Views: 37
When it comes to integrated circuits, common package types are LGA (Land Grid Array), PGA (Pin Grid Array) and BGA (Ball Grid Array). These packaging technologies determine how the chip is connected to the motherboard.

1. What is LGA (Land Grid Array)?
LGA stands for Land Grid Array. It is a package type with flat gold-plated contact pads on the bottom of the chip. These flat contacts are pressed onto the spring pins on the motherboard socket to make the connection. There are no pins on the chip. Unlike PGA, the pins are on the motherboard socket instead of the chip itself, making the processor more durable. Many of Intel's processors use LGA packages. In addition, LGA sockets are more expensive to manufacture.

LGA (Land Grid Array)

2. What is PGA (Pin Grid Array)?
PGA stands for Pin Grid Array. It is a package type with a row of small pins on the bottom of the processor. These pins are inserted into the holes on the motherboard socket to make the connection. It is common in AMD processors, such as AMD's Ryzen series, which uses PGA packages.

PGA (Pin Grid Array)

3. What is BGA (Ball Grid Array)?
BGA stands for Ball Grid Array, where the bottom surface of the chip has small solder balls (instead of pins) that are permanently fixed to the motherboard during the manufacturing process, forming a strong connection. BGA is where the chip is soldered directly to the motherboard, so it is not removable. BGA is mostly used in mobile devices, laptops, and is ideal for high-performance and space-constrained devices.

BGA (Ball Grid Array)

Comparison of LGA, PGA, and BGA

Feature LGA PGA BGA
Connection Type Flat lands on chip + pins on socket Pins on chip + holes on socket Solder balls directly attached to the motherboard
Durability Durable processor, fragile socket Fragile processor, durable socket Strong permanent connection
Upgradability Removable Removable Non-removable
Applications Desktop CPUs (e.g., Intel) Desktop CPUs (e.g., AMD) Embedded systems, laptops
Cost Higher socket cost Lower overall cost Higher manufacturing cost


Conclusion
LGA is favored for its durability and ease of installation in high-performance desktop CPUs. PGA is a cost-effective choice that AMD often uses for its processors. BGA is ideal for compact and portable devices.
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