Web Analytics Made Easy - Statcounter
Difference between Flexible Solder Mask and FPC Cover Layer | POE
This website uses cookies:
Our website use cookies to analyze website accesses and improve your online experience. By continuing browsing this website,you agree to our use of cookies and privacy policy.
Accept all cookies
This website uses cookies:
Our website use cookies to analyze website accesses and improve your online experience. By continuing browsing this website,you agree to our use of cookies and privacy policy.
Accept all cookies

Difference between Flexible Solder Mask and FPC Cover Layer

Flexible PCBs are becoming more and more popular as the demand for lightweight and flexible designs grows. Two key materials used in the manufacture of flexible PCBs are flexible solder mask and FPC cover layer. While both play a role in protecting and enhancing the functionality of the FPC, they differ greatly in composition, application, and performance.
Difference between Flexible Solder Mask and FPC Cover Layer
07 January 2025
Views: 22
Flexible PCBs are becoming more and more popular as the demand for lightweight and flexible designs grows. Two key materials used in the manufacture of flexible PCBs are flexible solder mask and FPC cover layer. While both play a role in protecting and enhancing the functionality of the FPC, they differ greatly in composition, application, and performance.
Flexible Solder Mask
What is Flexible Solder Mask?
Flexible solder mask is a liquid coating applied to the surface of the FPC. It acts as a protective layer to isolate circuit traces and prevent short circuits, oxidation. Solder mask is usually applied in liquid form and cured by UV exposure to form a thin and flexible layer.

What is FPC Cover Layer?
FPC cover layer is a flexible film made of polyimide (PI) material, laminated to the surface of the FPC using an adhesive layer, and is a traditional material used to protect the FPC and provide insulation and mechanical strength.

Key Differences Between Flexible Solder Mask and FPC Coverlay

Feature Flexible Solder Mask FPC Coverlay
Material Liquid polymer (epoxy or photoimageable) Polyimide film with adhesive
Application Method Screen printing or spray coating Lamination using heat and pressure
Thickness Thin, typically 20-30 microns Thicker, typically 50-100 microns
Durability Moderate protection High protection against bending/stress
Cost More cost-effective Higher material and processing costs
Design Complexity Suitable for fine-pitch and intricate designs Better for simple, robust designs
Flexibility Good flexibility but less robust Excellent flexibility and mechanical strength


Conclusion
Both flexible solder mask and FPC coverlay are essential materials to protect and enhance the performance of flexible PCBs. While flexible solder mask provides an economical solution for complex designs, FPC coverlay excels in durability in high-stress applications.
Share This Story, Choose Your Platform!
Application of related products
Skype:poepcba
Whatsapp: 85292069596
Files (zip or rar files accepted. Max 8MB.)
Link Us on