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Common problems in panelization during PCB manufacturing

Panelization is the process of arranging multiple PCB designs on a manufacturing board before segmentation and packaging. It can improve the utilization and efficiency of the substrate. There are also some common problems in this process. Let's take a look at them together.
Common problems in panelization during PCB manufacturing
25 June 2024
Views: 214
Panelization is the process of arranging multiple PCB designs on a manufacturing board before segmentation and packaging. It can improve the utilization and efficiency of the substrate. There are also some common problems in this process. Let's take a look at them together.

Problem description: When milling the board, the board is placed upside down or the board is tilted and the pins jump, resulting in milling damage.

Acceptable standards: Not accepted
Problem description: Damage caused by improper operation by employees.

Acceptable standards: 
1.The circuit is not allowed to be deformed and open beyond the line filling standard;
2. The area cannot exceed the oil filling standard of 6.35mm*6.35mm.
Problem description: Damage caused by improper operation by employees.

Acceptable standards: Damaged nickel, or exposed copper. Not acceptable.
Problem description: Wear marks on the machine rollers.

Acceptable standards: Nickel exposed in the wheel marks and copper exposed on the plate surface. Not acceptable.
Problem description: The V-CUT tool jumps and the machine screws are loose.

Acceptable standards: Not accepted
Problem description: V-CUT leaks or boards are mixed.

Acceptable standards: Not accepted
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