Common PCB packaging types
The function of PCB packaging is to protect electronic components, graphically display microelectronic components, transistors, chips, resistors, capacitors, etc. on the PCB board, and facilitate the insertion and installation of these electronic components on the PCB board after being packaged. welding.
What are the common PCB packaging types?
1. BGA package (Ball Grid Array): a spherical contact arrangement, one of the surface mount packages. Spherical bumps are made in an array on the back of the printed circuit board to replace the pins, an LSI chip is assembled on the front of the printed circuit board, and then sealed with molding resin or potting. It can have more than 200 pins and is a commonly used package for multi-pin LSI. The package body can also be made smaller than QFP, and BGA does not have to worry about the pin deformation problem like QFP.
2. DIP package: dual in-line package. One of the plug-in packages, the pins are drawn from both sides of the package. The packaging materials are plastic and ceramic. DIP is the most popular plug-in package, and its application range includes standard logic ICs, memory LSIs, microcomputer circuits, etc. The pin center distance is 2.54mm, the number of pins is from 6 to 64, and the width of the package is usually 15.2mm.
3. SOP package (Small Outline Package): Small outline package, SOP packaging technology was successfully developed by Philips Company from 1968 to 1969, and later gradually derived SOJ, TSOP, VSOP, SSOP, etc.
4. QFP package (Quad Flat No-lead Package): A flat package integrated circuit with no leads on four sides. It is a leadless package with a small square in the center of the bottom for heat dissipation. There are three types of base materials: ceramic, metal and plastic. Plastic QFP is a commonly used multi-pin LSI package. Common QFP packages include QFP-32, QFP-64, etc.
5. PLCC (Plastic Leaded Chip Carrier): Plastic chip carrier with leads. The pins are plastic products that come out from the four sides of the package and are shaped like a T. The pin center distance is 1.27mm, and the number of pins ranges from 18 to 84. J-shaped pins are not easily deformed and are easier to operate than QFP, but visual inspection after welding is more difficult.
6. COB (Chips on Board, COB): Chip mounting packaging is the simplest bare chip mounting technology. The chip is directly attached to the PCB. It is usually used for small and highly integrated applications.
BGA, DIP, SOP, SOP, QFP, and PLCC are common packaging methods when we manufacture PCBs. Failure to choose the correct and suitable packaging method will also have an impact on the performance of the circuit board.
