This website uses cookies:
Our website use cookies to analyze website accesses and improve your online experience. By continuing browsing this website,you agree to our use of cookies and privacy policy.
Accept all cookies
This website uses cookies:
Our website use cookies to analyze website accesses and improve your online experience. By continuing browsing this website,you agree to our use of cookies and privacy policy.
Accept all cookies

Common Defects in PCB Silver Plating Process

PCB silver plating is a key step in the manufacturing process, which can improve the conductivity, solderability and corrosion resistance of the circuit. However, there are also some problems in the silver plating process. Let's understand what are the common defects.
Common Defects in PCB Silver Plating Process
25 June 2024
Views: 191
PCB silver plating is a key step in the manufacturing process, which can improve the conductivity, solderability and corrosion resistance of the circuit. However, there are also some problems in the silver plating process. Let's understand what are the common defects.

Problem Description: The silver layer is not deposited on the patch position, IC pad and BGA position where silver deposition is required.

Acceptable standards: 1. Blackening of the patch position, IC pad and BGA position is not acceptable; 2. Slight blackening of the screw holes in the attached figure is acceptable.
Problem Description: The PAD may appear black, gray, red, or yellow.

Acceptable standards: Silver surface that turns yellow is not acceptable.
Problem Description: The silver surface is dark or partially white.

Acceptable standards:
1. Slightly off-white is acceptable;
2. Severely off-white is not acceptable.
Problem Description: The silver layer is not deposited on the patch position, IC pad and BGA position where silver deposition is required.

Acceptable standards: BGA position missing plating is not acceptable.
Problem Description: The silver layer is not deposited on the patch position, IC pad and BGA position where silver deposition is required.

Acceptable standards: Rough pads are not acceptable.
Problem Description: After silver immersion, the silver surface turns red, causing the thickness to fail to meet the MI requirements.

Acceptable standards: 
1. Slight redness is acceptable;
2. Severe redness is not acceptable.
Share This Story, Choose Your Platform!
Application of related products
Skype:poepcba
Whatsapp: 85292069596
Files (zip or rar files accepted. Max 8MB.)
Link Us on