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Common Defects in PCB Immersion Gold Finishing

The immersion gold process can provide enhanced anti-oxidation and corrosion protection for PCBs, enhance electrical conductivity, and make them more beautiful. However, there may be some undesirable phenomena in the process. Let's list some common undesirable phenomena.
Common Defects in PCB Immersion Gold Finishing
25 June 2024
Views: 301
The immersion gold process can provide enhanced anti-oxidation and corrosion protection for PCBs, enhance electrical conductivity, and make them more beautiful. However, there may be some undesirable phenomena in the process. Let's list some common undesirable phenomena.

Problem Description: Wrong color of gold.

Accepted standards: Not accepted
Problem Description: Failure to evenly cover

Accepted standards: Not accepted
Problem Description: The outer layer had dents before gold plating due to human manipulation.

Accepted standards: 
1. No dents larger than 0.125 mm are allowed in important areas;
2. No dents larger than 0.25 mm are allowed in non-important areas.
Problem Description: 
1. The gold surface is contaminated;
2. Insufficient maintenance;
3. The storage time exceeds the time specified in the document.

Accepted standards: Not accepted
Problem Description: 
1. The copper surface debris was not cleaned up during pre-treatment;
2. The nickel cylinder was not activated well.

Accepted standards: Not accepted
Problem Description: 
1. Abnormal gold sinking parameters;
2. High concentration and high temperature of the chemical solution;
3. High nickel-gold content;
4. Staying in the tank for too long.

Accepted standards: 
It is acceptable within the range of ±20% of the original spacing, or not exceeding 0.05mm (the smaller of the two).
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