What are interconnect defects in PCBs?

19 December 2024

During the PCB manufacturing process, interconnect defects can occur, resulting in reduced performance or complete failure. We will explain the types of interconnect defects in PCBs, their causes, and how to prevent them.

Common types of interconnect defects

1. Open circuit defects

When a conductive path is interrupted, an open circuit occurs. This prevents the signal from flowing between components. Open circuit defects are mostly caused by poor soldering, mechanical stress causing cracks in the traces, or incomplete through-hole plating.

How to solve it?

1. High-quality and stable soldering technology and solder.

2. Consider less mechanical stress when designing PCBs.

3. Quality inspection is required during the plating process.

2. Short circuit defects

When two conductive paths that should be isolated are accidentally connected, a short circuit occurs. The reasons are excessive solder bridging between adjacent pins, misaligned components during assembly, and possibly design errors that cause trace overlap.

How to solve it?

1. Use solder mask to prevent solder bridging.

2. Perform design rule checks to reduce subsequent errors.

3. Implementing Automated Optical Inspection (AOI).

3. Via Defects

Defects in vias can lead to unreliable interconnects, causing voids, misalignments, cracks, and other problems.

How to solve it?

1. Use high-quality drilling and plating processes.

2. Strictly adhere to alignment tolerances.

3. Perform reliability tests to detect cracks.

4. Delamination

Delamination occurs when the layers of the PCB separate and break the connection between them. Resulting in open circuits and signal loss. The cause can be poor bonding during lamination. High thermal stress during soldering, and moisture absorption by PCB materials.

How to solve it?

1. Use materials with low moisture absorption.

2. Optimize the lamination process.

3. Store in a controlled environment to prevent exposure to moisture.

5. Solder Joint Defects

Solder joint defects can weaken mechanical and electrical connections, leading to cold solder joints, voids, cracks, and other conditions.

How to solve it?

1. Use precise temperature profiles.

2. Optimize solder paste.

3. Perform stress testing.

6. Electromigration

High current flowing through small traces or increased operating temperature can cause electromigration, which is the movement of metal atoms caused by high current density, resulting in the formation of voids.

How to solve it?

1. Design PCBs with wider traces.

2. Use materials with better thermal performance.

3. Have adequate cooling mechanisms in the product.

How to detect interconnect defects

1. Automated Optical Inspection

AOI uses optical systems to identify defects and can detect misaligned components, shorts, or opens.

2. X-ray Inspection

X-rays are used to inspect internal structures for defects.

3. Electrical Testing

Electrical testing verifies the continuity of conductive paths and can detect opens or shorts.

4. Thermal Imaging

Thermal imaging can identify hot spots caused by defective connections.

Conclusion

Interconnect defects in PCBs can cause great problems for products, and early changes are involved when manufacturing PCBs, and early prevention can reduce the occurrence of this situation.

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