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How to achieve high-quality fine-pitch PCB assembly? | POE
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How to achieve high-quality fine-pitch PCB assembly

Fine-pitch PCB assembly refers to the process of SMT assembly in which the pitch between the leads of components is very small. As the size of electronic products continues to shrink, fine-pitch designs are becoming more and more common, and are widely used in smartphones, laptops, and consumer electronics devices. So how to achieve high-quality fine-pitch PCB assembly has become a problem that PCBA manufacturers need to solve.
Home >Blog >PCB/ PCBA Blog > How to achieve high-quality fine-pitch PCB assembly
How to achieve high-quality fine-pitch PCB assembly
27 December 2024
Views: 39
Fine-pitch PCB assembly refers to the process of SMT assembly in which the pitch between the leads of components is very small. As the size of electronic products continues to shrink, fine-pitch designs are becoming more and more common, and are widely used in smartphones, laptops, and consumer electronics devices. So how to achieve high-quality fine-pitch PCB assembly has become a problem that PCBA manufacturers need to solve.

fine-pitch PCB assembly

1. Design PCBs for fine-pitch assembly, ensure that the PCB design follows manufacturing constraints, and control the minimum trace width, spacing, and pad size. Using SMD pads, adding fiducial marks, optimizing trace routing and through-hole placement, and reducing thermal expansion mismatch can all help to achieve high-quality assembly of products.

2. Use components with precise lead sizes. To avoid clogging the template, use type 4 or type 5 low-viscosity solder paste to ensure smooth solder paste application.

3. Solder paste printing
1. Using an automatic solder paste printer with a precise alignment system is critical for fine-pitch assembly. 2. Ensure that the template aperture matches the pad size accurately, and use a solder paste inspection (SPI) system to measure the thickness and uniformity of the applied solder paste.

4. Component placement
1. Use a high-precision placement machine that can handle fine-pitch small components, and use an optical system to verify the placement position. During this period, it is necessary to ensure the placement of the components, taking into account the thermal expansion that may occur during the soldering process.

5. Reflow soldering
Reflow soldering is a critical step in fine-pitch PCB assembly. The correct temperature curve will not damage the components.

6. Inspection and quality control
Perform automatic optical inspection (AOI), X-ray inspection, and functional testing.

7. Avoid common defects
Pay attention to prevent solder bridging, ensure correct alignment, and control the amount of solder.

Conclusion
Because of the high precision of fine-pitch PCB assembly, attention needs to be paid to every detail to achieve high-quality fine-pitch assembly.
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