Difference between ENIG and ENEPIG

26 December 2024

ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) are two common surface treatments in PCBs. Both methods are designed to ensure soldering, prevent oxidation, and improve durability. However, their uses and characteristics are different.

What is ENIG?

ENIG is a double-layer metal coating process applied to the surface of a PCB. It is commonly used in

Consumer electronics, HDI PCBs, and circuit boards that require a long shelf life before assembly.

ENIG includes:

1. Electroless Nickel: A layer of nickel is chemically deposited on the copper surface. This nickel layer acts as a barrier to prevent copper diffusion and serves as a base for the gold layer.

2. Immersion Gold: A thin layer of gold is applied on top of the nickel using an immersion process. Gold prevents nickel oxidation and has good solderability.

Advantages of ENIG

1. Flat surface: Ideal for fine-pitch components and high-density designs.

2. Good solderability: The gold layer ensures simple and reliable soldering.

3. Durability: The nickel layer has excellent wear resistance.

4. Cost-effective: ENIG is generally more affordable compared to ENEPIG.

What is ENEPIG?

ENEPIG is known as "universal coating" and is a three-layer metal coating process that adds an additional palladium layer between nickel and gold. It is commonly used in aerospace, medical devices and military equipment, PCBs that require gold or aluminum wire bonding, and circuit boards with mixed soldering and bonding requirements.

ENEPIG includes:

1. Chemical nickel plating: Similar to the bottom layer of ENIG, it provides barrier and structural support.

2. Chemical palladium plating: The palladium layer is deposited on top of the nickel. This layer prevents nickel corrosion and improves wire bonding reliability.

3. Immersion gold: A thin gold layer is added on top to protect the palladium and ensure solderability.

Advantages of ENEPIG

1. Excellent wire bonding: The palladium layer makes ENEPIG suitable for gold and aluminum wire bonding.

2. Excellent corrosion resistance: Palladium prevents corrosion of the nickel layer, making ENEPIG highly reliable.

3. Versatile soldering: Compatible with a variety of solder types, including lead-free solder.

4. Better suited for high-frequency circuits: Reduces signal loss and improves performance in high-speed applications.

How to choose?

Choose ENIG if:

1. Cost is a major consideration.

2. Your application does not involve wire bonding.

3. You need a reliable, flat soldering surface.

Choose ENEPIG if:

1. Your PCB requires gold or aluminum wire bonding.

2. The application requires high reliability and corrosion resistance.

3. You are working with high-frequency circuits.

Conclusion

Both ENIG and ENEPIG are excellent surface finishes for PCBs, but they are suitable for different applications. ENIG is cost-effective and ideal for most consumer electronics, while ENEPIG is more suitable for advanced designs.

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